Snap’s place-and-go non-contact automatic measurement cycle takes less than three seconds to grab all feature dimensions of any type of component simply placed within its 78 mm field of view. All the operator needs to do is walk up to the benchtop mounted machine, place the part to be checked on its measuring platen and initiate the cycle.
The new VAST XTR gold probe from Carl Zeiss enables flexible and highly accurate measurements in industrial measuring, thus considerably increasing productivity and flexibility for operators.
The International Cycling Union (UCI, Union Cycliste Internationale) uses the ROMER Bike Measurement System from Hexagon Metrology at the Tour de France. Both road racing and time trial bike frames were checked during the approval process, to verify compliance with the UCI’s frame design regulations. The tests took place immediately after stages eight and nine of the Tour in Porrentruy in Switzerland and Besançon in France. This represents the first time that the technology has been applied at a bicycle racing event of this significance.
Hexagon Metrology has launched PC-DMIS 2012. PC-DMIS focuses on the collection, evaluation, management and presentation of manufacturing data to reduce scrap, improve throughput, reduce costs, and build lean manufacturing operations.
Though the Vantage laser tracker is 25% smaller and 28% lighter than its predecessor, FARO has included new in-line optic systems that improve long-range measurement by 45% to up to 80 metres (160 m diameter). Integrated WLAN eliminates tethering to laptops.
The Nikon Metrology MCAx Manual Coordinate Measuring Arm is a portable 7-axis measuring arm. It partners the ModelMaker MMDx/MMCx digital handheld laser scanners and Focus 10 Handheld scanning and inspection software.
FEI, an instrumentation company providing imaging and analysis systems for research and industry, has announced new Helios NanoLab DualBeam systems for engineers that need to make vital process improvement decisions. The 450HP and 1200HP DualBeam systems include new capability that meets the critical requirements for semiconductor process development at the 28nm device geometry node and below.
Bruker have announced three new 450mm X-Ray and AFM semiconductor metrology products to support the industry’s transition to larger wafer production. These new products include the InSight-450 3DAFM from Bruker’s Nano Surfaces division and both the next generation of the D8 FABLINE and the new S8 FABLINE-T X-ray systems from Bruker’s AXS division.
The High Definition Field Emission Scanning Electron Microscope (FE-SEM) SIGMA HD was revealed at the Microscopy & Microanalysis conference 2012 in Phoenix, Arizona by Carl Zeiss Microscopy. SIGMA HD has high resolution, fast imaging and easy sample navigation for nanoscale analytics.
The combination of NEXYGENPlus control and data analysis software and National Instruments data acquisition cards allows Lloyd Instruments' range of single column and twin column universal materials testing machines to communicate with a wide range of external equipment. This allows control and monitoring of external parameters of the sample as part of the materials test, with the results collected and presented in the required format by the software. This opens the door for a wide range of dynamic materials testing applications and a high level of automation.